描述
Wafer Dicing Saw配置
無配置OEM 代工型號說明
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.文檔
無文檔
DISCO
DFD6363
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116264
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6363
類別
Scribing, Cutting, Dicing
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116264
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Dicing Saw配置
無配置OEM 代工型號說明
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.文檔
無文檔