描述
Fully automatic dual-spindle dicing saw配置
Workpiece / Spindles: Up to 300mm (12in); dual spindle Alignment / Cleaning: Automatic alignment; spinner cleaning, rinsing and drying Handling: Automated Cassette -> Alignment -> Cutting -> Cleaning -> Cassette Reference Spindle: Half-cut Manual: 1.2kW, 6,000-60,000 rpm, 2 in blade Installed Configuration: Spindle power / blade size / half-cut option: not confirmed Reference Scope: Half-cut manual values are reference only; installed options unverified Application / Process: Wafer Singulation; back-endOEM 代工型號說明
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.文檔
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DISCO
DFD6360
類別
Scribing, Cutting, Dicing
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154433
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Fully automatic dual-spindle dicing saw配置
Workpiece / Spindles: Up to 300mm (12in); dual spindle Alignment / Cleaning: Automatic alignment; spinner cleaning, rinsing and drying Handling: Automated Cassette -> Alignment -> Cutting -> Cleaning -> Cassette Reference Spindle: Half-cut Manual: 1.2kW, 6,000-60,000 rpm, 2 in blade Installed Configuration: Spindle power / blade size / half-cut option: not confirmed Reference Scope: Half-cut manual values are reference only; installed options unverified Application / Process: Wafer Singulation; back-endOEM 代工型號說明
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.文檔
無文檔