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描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.文檔
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DISCO
DFD6341
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116461
晶圓尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
2017
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描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.文檔
無文檔