描述
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.配置
無配置OEM 代工型號說明
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."文檔
無文檔
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DISCO
DAD641
類別
Scribing, Cutting, Dicing
上次驗證: 9 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
153663
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.配置
無配置OEM 代工型號說明
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."文檔
無文檔