描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.文檔
無文檔
DISCO
DAD3360
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116465
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DAD3360
類別
Scribing, Cutting, Dicing
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116465
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.文檔
無文檔