描述
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.配置
無配置OEM 代工型號說明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文檔
無文檔
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DISCO
DAD321
類別
Scribing, Cutting, Dicing
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
140558
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.配置
無配置OEM 代工型號說明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文檔
無文檔