描述
DISCO DAD321 Automatic Dicing Saw Manufacturer: DISCO Model: DAD321 Equipment Type: Automatic Dicing Saw Maximum Wafer Size: 6 inch (150 mm) Spindle Configuration: Single Spindle Spindle Type: Air Bearing Spindle Power: 1.5 kW Spindle Speed: 3,000–40,000 rpm X-axis Cutting Range: 192 mm Y-axis Cutting Range: 162 mm Z-axis Stroke: 32 mm Index Resolution: 0.0001 mm Theta-axis Rotation: 380 degrees Blade Size: 2 inch (standard configuration) Power Supply: 200 VAC, 3-phase Maximum Power Consumption: 2.5 kVA Machine Dimensions: 500 × 1,050 × 1,455 mm Machine Weight: Approx. 500 kg Automatic precision dicing saw designed for cutting silicon wafers and glass substrates. Specifications may vary depending on machine configuration.配置
無配置OEM 代工型號說明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文檔
無文檔
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DISCO
DAD321
類別
Scribing, Cutting, Dicing
上次驗證: 8 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
153599
晶圓尺寸:
未知
年份:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
DISCO DAD321 Automatic Dicing Saw Manufacturer: DISCO Model: DAD321 Equipment Type: Automatic Dicing Saw Maximum Wafer Size: 6 inch (150 mm) Spindle Configuration: Single Spindle Spindle Type: Air Bearing Spindle Power: 1.5 kW Spindle Speed: 3,000–40,000 rpm X-axis Cutting Range: 192 mm Y-axis Cutting Range: 162 mm Z-axis Stroke: 32 mm Index Resolution: 0.0001 mm Theta-axis Rotation: 380 degrees Blade Size: 2 inch (standard configuration) Power Supply: 200 VAC, 3-phase Maximum Power Consumption: 2.5 kVA Machine Dimensions: 500 × 1,050 × 1,455 mm Machine Weight: Approx. 500 kg Automatic precision dicing saw designed for cutting silicon wafers and glass substrates. Specifications may vary depending on machine configuration.配置
無配置OEM 代工型號說明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.文檔
無文檔