Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

The ADT 7200 series is a versatile dicing system offered in three optimized configurations to cater to specific applications. This series includes models such as 7222, 7223, 7200-300 (2"), 7224, and 7200-300 (4"). Each model is designed to handle different materials and applications effectively, ranging from silicon wafers and thin-film devices to high-brightness LED packages, SAW filters, glass wafers, IR filters, PZT transducers, packages (QFN, BGA), quartz, ceramic LED packages, PCBs, ceramic substrates, and alumina (LTCC, HTCC). 

ADVANCED DICING TECHNOLOGIES (ADT)

7200

The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.

7900

7100

71MD

2”, Air-bearing spindle, DC-brushless, rotate up to 60krpm. Compatible with 2”- 3” hub and annular blades. Covering up to 8” round products.

7222

7100 XLA is available with 2" spindle or 4" spindle. The system capable to handle up to 18" x 24" size singulating large PCB substrates or hard and brittle glass and ceramic panels.

7100 XLA

ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.

8020

2”, Air-bearing spindle, DC- brushless motor capable to 60krpm. Compatible with 2”- 3” hub and annular blades. Covering up to 12” round product or square chuck (253 mm x 243 mm) with frame. Optimized for large panels and multi-panels such as: PCB, QFN and BGA Panels, High-brightness LED Packages, 12” and 8” Silicon Wafers, SAW Filters.

7200-300 2"

7930

4", DC-brushless, 2.5 KW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable. Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as: Glass, DWDM Optical Filters, Thick Ceramic Substrates


7124

4"-5" High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system, optimized for automated dicing of hard materials.

7224

Front mount 2” air bearing spindle, up to 1.8KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2”-  3”hub and annular blades. Covering up to 8” x 8” products.

7122

7200 GIGADICE

FULLY AUTOMATIC 12” TWIN DICING SYSTEM. ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.  ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.

8030

PROVECTUS LA

4”, Air-bearing spindle (2.5KW), DC- brushless motor capable to 30krpm. Compatible with 4”- 5” hub and annular blades. Covering up to 12” round product or square substrates (253 mm x 243 mm) with frame.

7200-300 4"

4" high power air bearing spindle, up to 2.5KW at 30krpm. DC Brushless motor provides close-loop speed control. Covering up to 12" round products, 12" x 9" square substrates with frame or 12" x 12" chuck without frame. The system is equipped with close-loop turn table, optimized for multi-angle dicing suitable for a variety of products such as: Ceramic substrates, Alumina, Hybrids, Thick film devices and more.

7134

2"-3" High-torque, DC-brushless, Air-bearing, 2.4 KW, 60 krpm spindle system, optimized for package singulation and IC applications.

7223

Front mount 2" air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2"-3" hub and hubless blades. Covering up to 12" round products, 12" x 9" square substrates with frame or 12" x 12" chuck without frame. The system is equipped with close-loop turn table, optimized for large panels and multi-panels such as: 12" and 8" Silicon wafers, PCB, QFN and BGA Panels, High-brightness LED Packages, SAW Filter.

7132

MW 975

The 80WT dicing saw for this project includes a special cassette compartment and handling system for extracting the two QFN substrates from the Lead Frame magazines and placing the QFN substrates on the cutting chuck. They also include a barcode reader, special dicing and cleaning chucks, and the Laser Height Measuring Tool (HMT) for accurately measuring the substrate's thickness to enable accurate tapeless shallow cuts supporting the Wettable process.

80WT

7920

The Tilting Spindle dicing system is designed to meet the needs of Optoelectronic component manufacturers by providing both perpendicular cuts and 8 angular cuts needed to suppress back-reflection in fiber optic components. The 71TS has the same machine specification as 7122 with 0.1angular repeatability and resolution. The system has dedicated programmable work stations for both angular settings. It is quick changeover from perpendicular (0) to any angle up to 15. The 71TS permits angular dicing of Planar Wave Guides such as: Silicon, Silica-on Silicon, Polymers on Si, InP, GaAs, Fiber Wave Guides, LiNbO3, Fused Silica.

ADVANCED DICING TECHNOLOGIES (ADT)

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7200

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7900

71MD

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