概述

The 80WT dicing saw for this project includes a special cassette compartment and handling system for extracting the two QFN substrates from the Lead Frame magazines and placing the QFN substrates on the cutting chuck. They also include a barcode reader, special dicing and cleaning chucks, and the Laser Height Measuring Tool (HMT) for accurately measuring the substrate's thickness to enable accurate tapeless shallow cuts supporting the Wettable process.