FULLY AUTOMATIC 12” TWIN DICING SYSTEM. ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.  ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.

Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

8030

類別

概述

活躍中的上架商品

服務

最熱門的上架商品

利用 Moov 將其上架並立即找到完美的買家。