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描述
Platform RTP Equipment配置
無配置OEM 代工型號說明
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文檔
無文檔
類別
RTP/RTA
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105897
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
VANTAGE RADOX
類別
RTP/RTA
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105897
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Platform RTP Equipment配置
無配置OEM 代工型號說明
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文檔
無文檔