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APPLIED MATERIALS (AMAT) VANTAGE RADOX
    描述
    This Tool will not come with HDD
    配置
    Model: Vantage Radiance RadOx / RTP Process: RadOx Technology: TP Platform Type: 300MM VANTAGE 3.X Application: DENSIFICATION / REFLOW Wafer Size: 300MM (12 INCH) Wafer Shape: SNNF Position A: (V352) RadOx2 Position B: (V352) RadOx2 Chamber A Process: TOXIC RP Chamber B Process: TOXIC RP WIP Delivery Type: OHT WIP DELIVERY Wafer Pass Thru and Storage: DUAL 2 SLOT ACTIVE COOLDOWN STATION Remote Control System Capable: NO Docked E99 Reading Capability: YES Loadport Types: SELOP 7 Load Port Operator Interface: STANDARD 8 LIGHT Configurable Colored Lights: YES Ionizing Systems: NONE Air Intake Systems: TOP INTAKE E84 Carrier Handoff: UPPER E84 INTERFACE ENABLED OHT E84 PIO Sensors and Cables: UPPER E84 SENSORS AND CABLES E99 Carrier ID: TIRIS WITH RF Carrier ID Host Cntrl Intrfc: NO Operator Access Switch: YES LIGHT TOWERS: 4 COLOR CONFIGURABLE LIGHT TOWER Interface A Option: YES eDiagnostic Ready: YES eDiagnostics: NONE FI Hot Blade - U BLADE: NONE FI MEE BLADE: NONE Out The Back Connection Type: RP Out The Back Connection NH3: NO Out The Back Connection H2: YES Chamber Water Cooling Kits: TWO CHAMBER RP Integration Hardware: CHAMBER A and B Rear Light Tower: Standard RAGB System Software: CGA Vantage Skins: TWO CHAMBER TOXIC LL/Transfer Pump: iPUP Monitor 1: 17 IN FLAT PANEL WITH KEYBOARD ON STAND Monitor 2: REMOTE 17 IN FLAT PANEL ON STAND Monitor 1 Cables: 25FT WITH 16 FEET EFFECTIVE Monitor 2 Cables: 25FT WITH 16 FEET EFFECTIVE Heat Exchanger Type: NONE Heat Exchanger Quantity: ZERO RTP Abatement Unit: NONE SEMI F47: YES System Labels: ENGLISH ONLY Semi S2 compliance: YES RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: YES H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx 2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: Yes H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM
    OEM 代工型號說明
    The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design
    文檔

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    verified-listing-icon

    已驗證

    類別
    RTP/RTA

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    106036


    晶圓尺寸:

    12"/300mm


    年份:

    2017


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    APPLIED MATERIALS (AMAT) VANTAGE RADOX

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    RTP/RTA
    年份: 2017條件: 二手
    上次驗證超過60天前

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    verified-listing-icon
    已驗證
    類別
    RTP/RTA
    上次驗證: 超過60天前
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/ab7891138c6e48a9bdf1e73579a036c8_ba66652e2f624d8a8c9d0b01bc46402845005c_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/2fdceeb529ba4e7ca63e687f3780643b_e2c557af24804b15b04f401ef52a518a45005c_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/8b6806f7df2f421394a059e9216146cc_76dbe9053da4413bae3c46639829ead845005c_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/b81f68d9ef67431ba8540c837d1e0ec5_2ddfb6606da2416c874189c703417082_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/c412b562dba3403996c03e759e684033_9be70cf13cab486e9c1fedc7f785fceb_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/185b4add7eb749cd8e8fc8d5d1f121cd_d410531870494455b7aa0edb32178e1f_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/cd215f803d4947d39618b2fcff54493d_8e9a4b6bccda40b8aaa74231387be73c45005c_mw.jpeg
    listing-photo-26883255995c4b78bb4f1729906cfef4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1769/26883255995c4b78bb4f1729906cfef4/676efcad051c4b09855f43e0c93aa6db_aaa5a84b7c5b4af3906483ef512c29e245005c_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    106036


    晶圓尺寸:

    12"/300mm


    年份:

    2017


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    This Tool will not come with HDD
    配置
    Model: Vantage Radiance RadOx / RTP Process: RadOx Technology: TP Platform Type: 300MM VANTAGE 3.X Application: DENSIFICATION / REFLOW Wafer Size: 300MM (12 INCH) Wafer Shape: SNNF Position A: (V352) RadOx2 Position B: (V352) RadOx2 Chamber A Process: TOXIC RP Chamber B Process: TOXIC RP WIP Delivery Type: OHT WIP DELIVERY Wafer Pass Thru and Storage: DUAL 2 SLOT ACTIVE COOLDOWN STATION Remote Control System Capable: NO Docked E99 Reading Capability: YES Loadport Types: SELOP 7 Load Port Operator Interface: STANDARD 8 LIGHT Configurable Colored Lights: YES Ionizing Systems: NONE Air Intake Systems: TOP INTAKE E84 Carrier Handoff: UPPER E84 INTERFACE ENABLED OHT E84 PIO Sensors and Cables: UPPER E84 SENSORS AND CABLES E99 Carrier ID: TIRIS WITH RF Carrier ID Host Cntrl Intrfc: NO Operator Access Switch: YES LIGHT TOWERS: 4 COLOR CONFIGURABLE LIGHT TOWER Interface A Option: YES eDiagnostic Ready: YES eDiagnostics: NONE FI Hot Blade - U BLADE: NONE FI MEE BLADE: NONE Out The Back Connection Type: RP Out The Back Connection NH3: NO Out The Back Connection H2: YES Chamber Water Cooling Kits: TWO CHAMBER RP Integration Hardware: CHAMBER A and B Rear Light Tower: Standard RAGB System Software: CGA Vantage Skins: TWO CHAMBER TOXIC LL/Transfer Pump: iPUP Monitor 1: 17 IN FLAT PANEL WITH KEYBOARD ON STAND Monitor 2: REMOTE 17 IN FLAT PANEL ON STAND Monitor 1 Cables: 25FT WITH 16 FEET EFFECTIVE Monitor 2 Cables: 25FT WITH 16 FEET EFFECTIVE Heat Exchanger Type: NONE Heat Exchanger Quantity: ZERO RTP Abatement Unit: NONE SEMI F47: YES System Labels: ENGLISH ONLY Semi S2 compliance: YES RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: YES H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx 2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM RTP Chamber Type: RADIANCE RADOX 2 300MM Technology Option: OPEN LOOP TUNER MFC Type: STEC Core Anneal and RTO: YES Ammonia Anneal: NONE BPSG Anneal: NOT APPLICABLE Rotation Type: WRLD TOXIC Low Flow O2: 5 SLM High Flow O2: 50 SLM Oxygen Analyzer: Yes H2: HIGH FLOW LOW FLOW AND SIDE INJECT Process N2 for Flammable MNFLD: NO Gas Pallet Type: TOXIC RP COMMON GAS PALLET MWBC Improvement Kit: Reflector plate with quartz cover to extend MWBC Chamber Integration Lines: RadOx2 RP Pump cable: 81 Feet Base Ring: Radox2 base ring Line 1: N2 (N/O), 50 SLM Line 2: O2, 50 SLM Line 3: O2, 5 SLM Line 4: - Line 5: - Line 6: H2, 15 SLM - Side Inject High Flow Line 7: H2, 22 SLM - High Flow Line 8: H2, 2 SLM - Low Flow Line 9: - Line 10: N2 (P/P), 30 SLM Restrictor Line 11: He, 30 SLM Line 12: N2 (BP), 50 SLM Line 13: N2 (Maglev), 100 SLM
    OEM 代工型號說明
    The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design
    文檔
    類似上架商品
    查看全部
    APPLIED MATERIALS (AMAT) VANTAGE RADOX

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    RTP/RTA年份: 2017條件: 二手上次驗證:超過60天前
    APPLIED MATERIALS (AMAT) VANTAGE RADOX

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    RTP/RTA年份: 0條件: 二手上次驗證:超過30天前
    APPLIED MATERIALS (AMAT) VANTAGE RADOX

    APPLIED MATERIALS (AMAT)

    VANTAGE RADOX

    RTP/RTA年份: 0條件: 二手上次驗證:超過60天前