
描述
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.配置
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 代工型號說明
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類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
102898
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CLUSTERLINE 200
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
102898
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.配置
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 代工型號說明
未提供文檔
無文檔