描述
無描述配置
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 代工型號說明
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.文檔
無文檔
APPLIED MATERIALS (AMAT)
ENDURA 5500
已驗證
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107897
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA 5500
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107897
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 代工型號說明
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.文檔
無文檔