ENDURA 5500
概述
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.
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73
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APPLIED MATERIALS (AMAT)
ENDURA 5500
PVD / Sputtering年份: 條件: 二手上次驗證超過60天前APPLIED MATERIALS (AMAT)
ENDURA 5500
PVD / Sputtering年份: 1995條件: 二手上次驗證超過60天前APPLIED MATERIALS (AMAT)
ENDURA 5500
PVD / Sputtering年份: 2000條件: 二手上次驗證超過60天前APPLIED MATERIALS (AMAT)
ENDURA 5500
PVD / Sputtering年份: 2001條件: 二手上次驗證超過60天前