關鍵商品詳情

條件:Used

作業狀態:unknown

產品編號:67819

晶圓尺寸:12"/300mm

年份:2010

描述

無可用的說明

配置

Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)

文檔

OEM 代工型號說明

The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.