描述
無描述配置
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文檔
無文檔
ASM
EAGLE XP
已驗證
類別
ALD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
67819
晶圓尺寸:
12"/300mm
年份:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
類別
ALD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
67819
晶圓尺寸:
12"/300mm
年份:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文檔
無文檔