描述
ALD (Atomic Layer Deposition)配置
無配置OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文檔
無文檔
ASM
EAGLE XP
已驗證
類別
ALD
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23230
晶圓尺寸:
12"/300mm
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
類別
ALD
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23230
晶圓尺寸:
12"/300mm
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ALD (Atomic Layer Deposition)配置
無配置OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文檔
無文檔