ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.

The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

描述

配置

OEM 代工型號說明

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ASM

EAGLE XP

ALD

關鍵商品詳情

類似上架商品

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP

EAGLE XP

ALD

關鍵商品詳情

描述

配置

OEM 代工型號說明

文檔

類似上架商品

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP