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ASM EAGLE XP
    描述
    ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)
    配置
    Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 Pa
    OEM 代工型號說明
    The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
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    ASM

    EAGLE XP

    verified-listing-icon

    已驗證

    類別
    ALD

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    53755


    晶圓尺寸:

    12"/300mm


    年份:

    2012

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    ASM EAGLE XP

    ASM

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    ALD
    年份: 2010條件: 二手
    上次驗證超過60天前

    ASM

    EAGLE XP

    verified-listing-icon
    已驗證
    類別
    ALD
    上次驗證: 超過60天前
    listing-photo-50a686b0417141cf8d2b3e0a46994ed4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/50a686b0417141cf8d2b3e0a46994ed4/399d575be904457ea5a21b35b032b604_e2376f00c1174586be8c578f643ec1381201a_mw.jpeg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    53755


    晶圓尺寸:

    12"/300mm


    年份:

    2012


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)
    配置
    Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 Pa
    OEM 代工型號說明
    The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
    文檔

    無文檔

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