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ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
  • ASM EAGLE XP
描述
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)
配置
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 Pa
OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
文檔

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verified-listing-icon

已驗證

類別
ALD

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

53755


晶圓尺寸:

12"/300mm


年份:

2012


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASM

EAGLE XP

verified-listing-icon
已驗證
類別
ALD
上次驗證: 超過60天前
listing-photo-50a686b0417141cf8d2b3e0a46994ed4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/50a686b0417141cf8d2b3e0a46994ed4/399d575be904457ea5a21b35b032b604_e2376f00c1174586be8c578f643ec1381201a_mw.jpeg
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關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

53755


晶圓尺寸:

12"/300mm


年份:

2012


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)
配置
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 Pa
OEM 代工型號說明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
文檔

無文檔