描述
無描述配置
Gold Chuck Top (Hot) Main CPU: VIP3A SACC (Semi Automatic Card Changer) Hardware Interface of Tester: ZIF Cassette Loader: Single Port, Left TypeOEM 代工型號說明
The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.文檔
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TEL / TOKYO ELECTRON
P-12XLm
已驗證
類別
Probers
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
20803
晶圓尺寸:
12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
P-12XLm
已驗證
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
20803
晶圓尺寸:
12"/300mm
年份:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Gold Chuck Top (Hot) Main CPU: VIP3A SACC (Semi Automatic Card Changer) Hardware Interface of Tester: ZIF Cassette Loader: Single Port, Left TypeOEM 代工型號說明
The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.文檔
無文檔