描述
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function配置
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 代工型號說明
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ACCRETECH / TSK
AP3000e
已驗證
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
New
作業狀態:
未知
產品編號:
89683
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
AP3000e
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
New
作業狀態:
未知
產品編號:
89683
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function配置
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 代工型號說明
未提供文檔
無文檔