描述
Working Condition配置
Type 6 OCR Direct Docking for Ultraflex The main configurations include OCR, normal high temperature, Ni type chuck, clean pad, DD type (Direct Docking for Ultraflex) without hinge. Others are standardOEM 代工型號說明
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.文檔
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ACCRETECH / TSK
UF3000EX-e
已驗證
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91522
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
UF3000EX-e
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91522
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Working Condition配置
Type 6 OCR Direct Docking for Ultraflex The main configurations include OCR, normal high temperature, Ni type chuck, clean pad, DD type (Direct Docking for Ultraflex) without hinge. Others are standardOEM 代工型號說明
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.文檔
無文檔