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LAM RESEARCH / NOVELLUS CONCEPT ONE "C1"
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The Novellus Concept-One is a PECVD tool that uses plasma-enhanced chemical vapor deposition to deposit various dielectric films on silicon wafers. It can deposit oxide, nitride, oxynitride, PSG and TEOS oxide films. The Concept1 is also a PECVD tool that deposits dielectric films on 6" wafers. It is capable of depositing thick films in excess of 1 um and allows CMOS compatible metals, making it suitable for backend processes. The system deposits on multiple wafers in parallel in a batch-type reactor.
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    已驗證

    類別
    PECVD

    上次驗證: 4 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    149851


    晶圓尺寸:

    6"/150mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    LAM RESEARCH / NOVELLUS CONCEPT ONE "C1"

    LAM RESEARCH / NOVELLUS

    CONCEPT ONE "C1"

    PECVD
    年份: 0條件: 二手
    上次驗證4 天前

    LAM RESEARCH / NOVELLUS

    CONCEPT ONE "C1"

    verified-listing-icon
    已驗證
    類別
    PECVD
    上次驗證: 4 天前
    listing-photo-0959e065629f417d8d4406029085b8f7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/92712/0959e065629f417d8d4406029085b8f7/3c90525142684349a8bfb4f79c3ce6c8_079e1e32be3d4fd99b27635c856ce9e145005c_f.jpeg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    149851


    晶圓尺寸:

    6"/150mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The Novellus Concept-One is a PECVD tool that uses plasma-enhanced chemical vapor deposition to deposit various dielectric films on silicon wafers. It can deposit oxide, nitride, oxynitride, PSG and TEOS oxide films. The Concept1 is also a PECVD tool that deposits dielectric films on 6" wafers. It is capable of depositing thick films in excess of 1 um and allows CMOS compatible metals, making it suitable for backend processes. The system deposits on multiple wafers in parallel in a batch-type reactor.
    文檔

    無文檔

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