描述
無描述配置
With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM 代工型號說明
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.文檔
無文檔
NITTO
DR8500III
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65683
晶圓尺寸:
未知
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NITTO
DR8500III
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65683
晶圓尺寸:
未知
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM 代工型號說明
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.文檔
無文檔