DR8500III
概述
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
活躍中的上架商品
8
服務
檢驗、保險、評估、物流
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
8
檢驗、保險、評估、物流
