描述
No missing, No HDD配置
無配置OEM 代工型號說明
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文檔
無文檔
BESI / FICO
AMS-W40-306
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57373
晶圓尺寸:
未知
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-W40-306
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57373
晶圓尺寸:
未知
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
No missing, No HDD配置
無配置OEM 代工型號說明
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文檔
無文檔