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BESI / FICO AMS-W40-306
    描述
    無描述
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    OEM 代工型號說明
    The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.
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    BESI / FICO

    AMS-W40-306

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    上次驗證: 超過60天前

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    條件:

    Used


    作業狀態:

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    產品編號:

    80099


    晶圓尺寸:

    未知


    年份:

    未知

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    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    Packaging
    年份: 2011條件: 二手
    上次驗證超過60天前

    BESI / FICO

    AMS-W40-306

    verified-listing-icon
    已驗證
    類別
    Packaging
    上次驗證: 超過60天前
    listing-photo-7e9f3a0c565f4f0185f9f910e09b1377-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    80099


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.
    文檔

    無文檔

    類似上架商品
    查看全部
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    Packaging年份: 2011條件: 二手上次驗證: 超過60天前
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    Packaging年份: 0條件: 二手上次驗證: 超過60天前