描述
無描述配置
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.文檔
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
已驗證
類別
MOCVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
69602
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
類別
MOCVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
69602
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.文檔
無文檔