描述
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.配置
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 代工型號說明
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SONIX
QUANTUM 350
已驗證
類別
Microscope
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55840
晶圓尺寸:
8"/200mm
年份:
2006
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SONIX
QUANTUM 350
類別
Microscope
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55840
晶圓尺寸:
8"/200mm
年份:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.配置
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 代工型號說明
未提供文檔
無文檔