概述

The SpectraFx 200 is a thin-film measurement system that uses spectroscopic ellipsometry technology to non-destructively measure process variation on product wafers. It is optimized for 300mm fab-to-fab and tool-to-tool matching and provides enhanced performance on ultra-thin gate oxides, multi-stack, and 193-nm anti-reflective coating layers. It also has a 2D film stress option that measures the entire wafer to generate a 2D wafer map.