描述
無描述配置
Non Contact Thickness GageOEM 代工型號說明
The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter.文檔
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KLA / MICROSENSE
6034
已驗證
類別
Metrology
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91980
晶圓尺寸:
6"/150mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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查看全部KLA / MICROSENSE
6034
類別
Metrology
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91980
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Non Contact Thickness GageOEM 代工型號說明
The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter.文檔
無文檔