6034
概述
The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter.
活躍中的上架商品
1
服務
檢驗、保險、評估、物流