描述
Wafer Inspection Equipment配置
無配置OEM 代工型號說明
With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.文檔
無文檔
類別
Metrology
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
119932
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
DSM200
類別
Metrology
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
119932
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Inspection Equipment配置
無配置OEM 代工型號說明
With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.文檔
無文檔