概述

With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.