描述
Suss Microtech MA8/BA8 Gen2配置
With BSA Manual load Windows OSOEM 代工型號說明
SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production. MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications. After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies: Bond alignment near-field holographic lithography , UV processing UV curing nanoimprinting, etc.文檔
無文檔
SUSS MicroTec / KARL SUSS
MA8/BA8
已驗證
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
102701
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA8/BA8
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
102701
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Suss Microtech MA8/BA8 Gen2配置
With BSA Manual load Windows OSOEM 代工型號說明
SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production. MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications. After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies: Bond alignment near-field holographic lithography , UV processing UV curing nanoimprinting, etc.文檔
無文檔