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描述
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new配置
無配置OEM 代工型號說明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文檔
無文檔
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
76556
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
76556
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new配置
無配置OEM 代工型號說明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文檔
無文檔