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描述
Tool is deinstalled and crated配置
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM 代工型號說明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文檔
無文檔
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
51170
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
51170
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tool is deinstalled and crated配置
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM 代工型號說明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.文檔
無文檔