描述
-Topside Alignment (TSA) -Backside Alignment (BSA) -Manual Handling -Manual Controlled Stage -Up to 6"/150mm Wafer Capable (with correct tooling) -Objectives (10x top and backside) -Vacuum Chuck for 6” wafers and 4" wafers -Maskholder for 7” Masks and 5" Masks -Mask Load Frames 7” and 5" -Tooling Tray -Uniformity Test Plate -EVG 620 offers Proximity, Soft Contact, Hard Contact or Vacuum Contact Exposure Modes -Tooling Exchanges are Quick, Simple and can be Performed Within Minutes -Lamphouse: 1000W Lamphouse Optional 500W / 350W Or LED Upgrade Upon Request -Exposure Optics: Type C, 350nm - 450nm, Broadband -Microsoft Windows based User Interface -System PC, Keyboard, Cables -PDF Manual for EVG 620配置
無配置OEM 代工型號說明
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文檔
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EVGroup (EVG)
EVG620
已驗證
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
25960
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG620
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
25960
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
-Topside Alignment (TSA) -Backside Alignment (BSA) -Manual Handling -Manual Controlled Stage -Up to 6"/150mm Wafer Capable (with correct tooling) -Objectives (10x top and backside) -Vacuum Chuck for 6” wafers and 4" wafers -Maskholder for 7” Masks and 5" Masks -Mask Load Frames 7” and 5" -Tooling Tray -Uniformity Test Plate -EVG 620 offers Proximity, Soft Contact, Hard Contact or Vacuum Contact Exposure Modes -Tooling Exchanges are Quick, Simple and can be Performed Within Minutes -Lamphouse: 1000W Lamphouse Optional 500W / 350W Or LED Upgrade Upon Request -Exposure Optics: Type C, 350nm - 450nm, Broadband -Microsoft Windows based User Interface -System PC, Keyboard, Cables -PDF Manual for EVG 620配置
無配置OEM 代工型號說明
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文檔
無文檔