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描述
Laser Repair Working condition配置
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.文檔
無文檔
ESI
9830
類別
Laser
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
50348
晶圓尺寸:
未知
年份:
2006
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Refurbishment Services
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描述
Laser Repair Working condition配置
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.文檔
無文檔