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ESI 9830
  • ESI 9830
描述
No missing parts and It include the HDD with the software also
配置
無配置
OEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文檔

無文檔

PREFERRED
 
SELLER
verified-listing-icon

已驗證

類別
Laser

上次驗證: 超過60天前

Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

Deinstalled


產品編號:

117593


晶圓尺寸:

未知


年份:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

ESI

9830

verified-listing-icon
已驗證
類別
Laser
上次驗證: 超過60天前
listing-photo-023b6742a37541ba9d2f1cacbab89e77-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1746/023b6742a37541ba9d2f1cacbab89e77/0b881c4743fe46e09d1e0d4c92712bc9_1_mw.png
Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

Deinstalled


產品編號:

117593


晶圓尺寸:

未知


年份:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
No missing parts and It include the HDD with the software also
配置
無配置
OEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文檔

無文檔