跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
ESI 9830
  • ESI 9830
  • ESI 9830
  • ESI 9830
描述
無描述
配置
無配置
OEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文檔

無文檔

verified-listing-icon

已驗證

類別
Laser

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

25436


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ESI

9830

verified-listing-icon
已驗證
類別
Laser
上次驗證: 超過60天前
listing-photo-4d58b38c0b7742f79e235b6dbb075aa9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

25436


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
文檔

無文檔