描述
Vertical Furnace配置
OxideOEM 代工型號說明
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.文檔
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TEL / TOKYO ELECTRON
TELINDY PLUS IRad
已驗證
類別
Furnaces / Diffusion
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
14125
晶圓尺寸:
12"/300mm
年份:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELINDY PLUS IRad
類別
Furnaces / Diffusion
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
14125
晶圓尺寸:
12"/300mm
年份:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Vertical Furnace配置
OxideOEM 代工型號說明
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.文檔
無文檔