描述
Vertical Furnace配置
<p>Tool is operating in clean room.</p><p> </p><p>Tube Material:Quartz</p><p>Boat Material:Quartz</p><p>Production wafes:50</p><p>Pressure control:APC Valve</p><p>Process Gas:DCS(F.S:200sccm),NH3(F.S:2slm),HF(F.S:5slm),20%F2/N2(F.S:20slm),N2</p><p>MFC Maker:STEC</p><p>MFC Model:F700series</p><p>Process Temp:600-700deg</p><p>Pump Maker:EDWARDS</p><p>Pump Type:iH1800</p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p>OEM 代工型號說明
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.文檔
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TEL / TOKYO ELECTRON
TELFORMULA
已驗證
類別
Furnaces / Diffusion
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13678
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELFORMULA
類別
Furnaces / Diffusion
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13678
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Vertical Furnace配置
<p>Tool is operating in clean room.</p><p> </p><p>Tube Material:Quartz</p><p>Boat Material:Quartz</p><p>Production wafes:50</p><p>Pressure control:APC Valve</p><p>Process Gas:DCS(F.S:200sccm),NH3(F.S:2slm),HF(F.S:5slm),20%F2/N2(F.S:20slm),N2</p><p>MFC Maker:STEC</p><p>MFC Model:F700series</p><p>Process Temp:600-700deg</p><p>Pump Maker:EDWARDS</p><p>Pump Type:iH1800</p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p>OEM 代工型號說明
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.文檔
無文檔