描述
無描述配置
無配置OEM 代工型號說明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
130018
晶圓尺寸:
未知
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
AMICRA NOVA PLUS
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
130018
晶圓尺寸:
未知
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control文檔
無文檔