跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
  • ASMPT AMICRA NOVA PLUS
描述
無描述
配置
無配置
OEM 代工型號說明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control
文檔

無文檔

類別
Flip Chip Bonders

上次驗證: 29 天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

130018


晶圓尺寸:

未知


年份:

2011


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASMPT

AMICRA NOVA PLUS

verified-listing-icon
已驗證
類別
Flip Chip Bonders
上次驗證: 29 天前
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/331e80affb024c01a7f927f357f6f445_amicranovaplus1_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/4d757b0e2ed942b0b98aa1385ee821f6_amicranova2_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/b8576aadc1344b36b210c99312d42bae_novaplus2_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/666758361739482391697cf89f3d5ef8_novaplus1_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/9bb36ac1575749c6bc44e21b9783a238_novaplus3_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/d02b222fa2d34b3f8e7e99442c455408_novaplus4_mw.png
listing-photo-5b84f90ce4d14b14b4a47da7d04f28d0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78911/5b84f90ce4d14b14b4a47da7d04f28d0/6aa9bea9e8cc498a9941f3873c1ec92e_novaplus5_mw.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

130018


晶圓尺寸:

未知


年份:

2011


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control
文檔

無文檔