ASMPT

AMICRA AFC Plus

The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including:

-High precision die bonder/flip chip bonder
-Accuracy +/-2.5m @ 3 sigma
-Cycle-time of < 3 sec*
-Modular machine concept for all micro assembly applications
-Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
-Multi flip chip bonding
-Wafer mapping
-Post bond inspection/measurement
-Substrate working area of 550x600mm
-Active bond-force-control

ASMPT

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最熱門的 ASMPT Flip Chip Bonders

AMICRA AFC Plus

AMICRA NOVA PLUS

利用 Moov 將其上架並立即找到完美的買家。

所有 ASMPT Flip Chip Bonders