描述
Die Bonder / Flip Chip Bonder Single Bond配置
Die Bonding machine for passive alignment Eutectic process (Laser melt) with Silicon substates accuracy less than 1um placementOEM 代工型號說明
未提供文檔
無文檔
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
149014
晶圓尺寸:
未知
年份:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
ASMPT
AMICRA AFC Plus
類別
Flip Chip Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
149014
晶圓尺寸:
未知
年份:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die Bonder / Flip Chip Bonder Single Bond配置
Die Bonding machine for passive alignment Eutectic process (Laser melt) with Silicon substates accuracy less than 1um placementOEM 代工型號說明
未提供文檔
無文檔