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SYNAX S9
  • SYNAX S9
  • SYNAX S9
  • SYNAX S9
描述
無描述
配置
無配置
OEM 代工型號說明
Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000
文檔

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verified-listing-icon

已驗證

類別
Final Test

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

104345


晶圓尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

SYNAX

S9

verified-listing-icon
已驗證
類別
Final Test
上次驗證: 超過60天前
listing-photo-edbc17bdca3d4adeb36950272afd18f3-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

104345


晶圓尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000
文檔

無文檔