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SYNAX S9
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000
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    verified-listing-icon

    已驗證

    類別
    Final Test

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    120146


    晶圓尺寸:

    未知


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    SYNAX

    S9

    verified-listing-icon
    已驗證
    類別
    Final Test
    上次驗證: 超過60天前
    listing-photo-38a2d7910d0445f88d651a1a9e29a947-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    120146


    晶圓尺寸:

    未知


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000
    文檔

    無文檔