描述
Wafer Tester配置
Wafer TesterOEM 代工型號說明
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.文檔
無文檔
ADVANTEST
T5377
已驗證
類別
Final Test
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
90916
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部ADVANTEST
T5377
類別
Final Test
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
90916
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Tester配置
Wafer TesterOEM 代工型號說明
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.文檔
無文檔