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描述
無描述配置
3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM 代工型號說明
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.文檔
無文檔
PREFERRED
SELLER
類別
Electro Plating
上次驗證: 超過60天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113539
晶圓尺寸:
12"/300mm
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
類別
Electro Plating
上次驗證: 超過60天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113539
晶圓尺寸:
12"/300mm
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM 代工型號說明
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.文檔
無文檔