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APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
描述
無描述
配置
RE10F3ECD124
OEM 代工型號說明
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.
文檔

無文檔

類別
Electro Plating

上次驗證: 7 天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

119537


晶圓尺寸:

未知


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER ECD310

verified-listing-icon
已驗證
類別
Electro Plating
上次驗證: 7 天前
listing-photo-f972afdebb7e45e2ab02faae5abd1f37-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

119537


晶圓尺寸:

未知


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
RE10F3ECD124
OEM 代工型號說明
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.
文檔

無文檔